T6 ProGrade Max
Thermal Compound ProGrade Max T6
Experience ultra-performing thermal paste designed to optimize heat transmission to your CPU or GPU, ensuring superior cooling efficiency and delivering exceptional thermal conductivity for maximum performance.
Our thermal paste boasts exceptional thermal conductivity up to 14.8 W/mk, ensuring optimal heat dissipation for peak performance in high-demand applications.
Not only does our paste excel in heat transfer but is also non-electrically conductive, providing a safe and reliable solution for your electronic components. Ensure effective cooling without the risk of electrical interference.
Experience hassle-free maintenance with our pastes' non-curing properties, eliminating the need for waiting times. This means you can achieve peak performance right from the start, ensuring efficient cooling without delays
Make application a breeze with our thermal paste kit, thoughtfully equipped with clean wipes (x2) and a spreader for a mess-free and convenient experience.
Application | Thermally conductive compound |
---|---|
Thermal Conductivity | 14.8 W/mK |
Specific Gravity | 2.8 |
Form | Non-curing compound |
Operating Temperature | -50°C to 280°C |
Thermal Impedance | <0.613 (°C-cm²/W) @ 60 psi |
Colour | Grey |
Viscosity | 95,000±2000 (mPa.s/ 22°C) |
Weight | 4g |
Package Dimensions | 130 x 60 x 20 mm |
Product Code | AK-T695-4G |