Akasa thermal gap filler is a thermally conductive interface pad which is versatile and suitable for use between components and their heat sinks. The pad moulds around uneven surfaces and can be cut to size to effectively solve and manage unwanted thermal issues.

Suitable for uneven surfaces
Cut to size and stackable
Two sizes: 1.5mm and 5mm thickness available

Size 30 x 30 x 1.5mm
Quantity 2 pcs
material Silicone elastomer
Thermal conductivity 1.2 W/mK
Hardness (shore 00) 27 (at 3 second delay)
Density 1.78 g/cc
Temperature range -40ºC to 160ºC
Volume resistivity 1.0 x 10 13 Ohm-cm
Coefficient thermal expansion (CTE) 600 ppm/C
Product code AK-TT300-01