Resistance Benchmarking AK TC 5022 - Low thermal resistance for superior heat transfer	AK-TC 5022 THERMAL COMPOUND Pro-Grade+ Silicone-tech Evolutionary 5022 Thermal Compound Get more from your cooler. Pro-grade+ Silicone-tech evolution 5022 is the ultimate thermal compound. It provides the key performance goal of low thermal resistance even at low pressures. AMD recommended. RoHS compliant. Low thermal resistance for superior heat transfer, 0.061cm²C/W @40 PSI Thin bond line for hi-efficiency conductivity Enhance cooling performance Non pressure dependent Multi-language instructions included RoHS compliant AMD recommended  Colour  Grey  Viscosity  102K cPs  Thermal conductivity  4.0W/mK  Operating temperature  -45°C ~ 200°C  Operating Range  0.061cm²C/W @40PSI  Volume  3.5g  Product code  AK-TC 5022 Spreader card Installation 1. Before applying the thermal compound, please make sure the top surface of the CPU die or heat spreader is perfectly clean. If the die has any residue of old thermal compound present, clean off with Isopropyl or AKASA Timclean. 2. Place a small amount of AK-460 on the surface of the dieand carefully spread evenly using the spreader card included. A thin film is ideal; extra thermal compound will not improve performance. 3.Now you are ready to install your CPU cooler.   akasa is not responsible for the content of external internet sites     Computer GEIL (Danish) ‘God performance, Medfølger plastikkort til at fordele pasta med, & Vejledning på 6 store sprog’ more..     Technic3D.com (German) ‘Effizienz 85%' more..     Doomed PC ‘Akasa have managed to produce the best thermal paste we have ever tested with their Pro-grade+ 5022 line' ' more..     Xtreme Computing ‘Well yes I am impressed with this paste, the 5022 does it self some justice in the performance market.' ' more..